CRM
CRM
Chip-Particle Removal Machine
Chip-particle inspection & removal machine features as a final cleaning process for CMOS imaging sensor before glass bonding.
Using revolutionary technology developed by INTERSTELLA – AMP® Adaptive Multi-layer Profiling has the ability to detect and remove chip particles up to 1um in size. As such, the overall yield can be improved by more than 1.2% at production line. (Assuming existing yield loss due to chip particles is 3%).
CRM comes with a high performance dual sites handling system offering extraordinary throughput. In return, this could enable users to enjoy the highest performance at the minimum cost of ownership.
Machine Specification
Model
Main frame – Mechanism
Main frame – Body
Main frame – Bottom
Main Frame – Base
Main Frame – Dimension & Weight
Electrical – Voltage
Electrical – Power Consumption
Compliance
Clean Air
Capability
Performance
Technology
Single Track, Dual Site, Detect & Removal System
Aluminium Profile with Stainless Steel Plate Cover
Granite Base with Active Air Anti Vibration Control
Dust-proof Leveling Foot
W1700 x D1575 x H2410 mm | 1600kg
Single Phase 220V
6.6 Kw/h (Max)
SMEMA
Class 10 | FFU with HEPA Filter
EN1899 Class H13/H14, Air Flow 0.33m/s
0.5MPa | Ø12 x 1
1um Particle Inspection & Removal at >90% Yield
UPH 2000
AMP® Adaptive Multi-layer Profiling
Objectives
To meet users needs towards high speed UPH, precise accuracy and consistant reliability to meet up with the increasing demand on competitive cost and excel performance on CCM technology.
Features
- Fully automatic operation @ >90% yield for >1um chip particle removal
- Effective chip particle removal with non-damaging process
Performance
- Product yield improvement by approximately 5%
- Detection rate up to 90%
- Removal rate up to 85%
UPH
- High productivity and ease of configuration
- Single site approximately 900 units per hour
- Dual site approximately 2,000 units per hour (based on chip particle rate of <5%)
PROCESS FLOW
Compact Camera Module [CCM] Assembly Flow
Technology Roadmap
